2026-04-30 09:26 UTC
First samples on the first run from wafer.space!
There is a disclaimer with these parts, that only ~80% are fully bonded successfully.
This could be marketed as a feature, an air gapped solution using state of the art wireless bond wires. 😜
Replies (4)
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@geert@society.oftrolls.com 2026-04-30 09:29
@gregdavill@chaos.social Tried to fix it yourself?
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@madkiwi@mastodon.world 2026-04-30 09:30
@gregdavill@chaos.social disappointed it’s not gold bond wires
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@infosecdj@infosec.exchange 2026-04-30 09:32
@gregdavill@chaos.social it's okay, it is capacitively coupled. :)
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@anymouse_404@glitch.social 2026-04-30 14:05
@gregdavill@chaos.social How high-frequency does the design need to run for that to not matter?